Apple MacBook may introduce 3D chip stacking technology smaller in size and stronger performance

[ Gearbest Technology News]The latest news reveals that Apple plans to use advanced 3D chip stacking technology SoIC in its MacBook series launched in 2025, a breakthrough integrated circuit packaging technology. This technology achieves the goal of achieving higher integration in a smaller volume by stacking multiple chips vertically.

Currently, the industry is accelerating the transition to glass substrates to replace the existing 2.5D and 3D packaging technologies. Although AMD, Intel and Samsung have attracted much attention in the field of chip glass substrate supply, it is worth noting that TSMC is not absent in this field. Although TSMC has kept a low profile on this, industry analysts have noticed signs that it is developing similar solutions, and senior executives of TSMC have revealed their firm determination to achieve this goal, according to people familiar with the matter.

Meanwhile, TSMC is exploring a new path in the field of advanced chip packaging in an innovative way – steering rectangular chip substrates. According to a report released by TechSpot, TSMC plans to move from traditional circular wafers to rectangular substrates, a move aimed at improving chip layout efficiency on each wafer, allowing a significant increase in the number of chips that can be placed.

Currently, this rectangular substrate is in the test stage, with a size of 510 mm x 515 mm, which is more than tripled in size than traditional circular wafers. In addition, the rectangular design significantly reduces waste of edge space and further improves material utilization.

It is worth noting that TSMC’s competitor Samsung is also actively investing resources to focus on the research and development of glass substrates in chip manufacturing, and plans to launch related products as early as 2026.

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