SK Group Chairman Choi Tae-won: Plans to triple wafer production capacity by 2034

[ Gearbest Technology News]Recently, SK Hynix Chairman Cui Taiyuan revealed that the company plans to triple its chip wafer production capacity to the current level by 2034 to cope with the growth in demand for advanced memory chips and prepare for new demands brought about by the development of AI.

SK hynix

Cui Taiyuan said that in the next ten years, SK Hynix will continue to expand wafer production capacity. Wafers are the basic material for semiconductor manufacturing, usually thin sheets of crystalline silicon, used to carry integrated circuits and various types of microchips. The increase in wafer production capacity means that the company can support the production of more memory chips in the future.

In the current market environment, the demand for advanced memory chips continues to increase, and production capacity assurance has become an important issue in the industry. As one of the world's major memory chip manufacturers, SK Hynix has proposed a long-term production expansion plan this time with the goal of meeting the future demand for high-performance storage products in consumer electronics, data centers and AI-related applications. Cui Taiyuan said that as AI gradually integrates into personal life and corporate operations, the demand for advanced storage system chips will further expand.

SK Hynix has launched the first phase of this plan and is building four wafer fabs in South Korea. These fabs are expected to be completed around next year. After the relevant projects are completed, SK Group also plans to expand its chip factories to overseas markets. According to the current planning, Japan is considered as one of the potential locations due to its strong technological foundation, skilled labor force and relatively complete industrial infrastructure.

Affected by the news of the production expansion plan, SK Hynix's stock price rose by 2.6% to 210,000 won. Overall, the company's 2034 target shows that it is planning for future production capacity in advance around the needs of advanced storage and AI applications.