It is revealed that SK Hynix and Intel are advancing cooperation in AI chip supply chain, which may usher in adjustments.

[ Gearbest Technology News]Recently, according to foreign media reports, SK Hynix is ​​promoting cooperation with Intel in the field of advanced packaging. The two parties have launched research and development on 2.5D packaging technology and are testing solutions to integrate HBM with system semiconductors. News shows that SK Hynix is ​​evaluating the introduction of Intel's EMIB technology, and related testing has entered the early stages. This trend appears in the context of continued tightness in TSMC’s 2.5D packaging production capacity. The market is therefore concerned about whether there will be more changes in the AI ​​accelerator packaging supply chain.

2.5D packaging is to add a thin-film intermediary layer between the chip and the substrate to improve the connection efficiency and overall performance between chips. It is mainly used in high-performance computing products such as AI accelerators. Currently, AI accelerators launched by companies such as NVIDIA and AMD usually require the integration of high-performance system chips such as GPUs and HBM through 2.5D packaging. At this stage, the global supply chain relies heavily on TSMC's CoWoS solution. SK Hynix has also been cooperating with TSMC in the fields of HBM and 2.5D packaging.

It is understood that SK Hynix is ​​currently obtaining EMIB-equipped substrates from Intel and conducting combined testing of HBM and system chips. People familiar with the matter said that the project is still in the early research and development stage, but SK Hynix is ​​actively verifying the feasibility of using EMIB to achieve 2.5D packaging, and is also screening materials and component solutions required for future mass production. For SK Hynix, although the company does not directly mass-produce 2.5D packaging, understanding the packaging structure and characteristics in advance will help optimize the yield and stability of HBM products. The company is currently running a small-scale 2.5D packaging R&D line in South Korea.

From Intel's perspective, cooperation with SK Hynix will also help expand its advanced packaging business. Different from traditional solutions that use large-area interposers, EMIB realizes chip-to-chip connections through small silicon bridges, and only arranges bridge structures where interconnections are needed, so it has higher flexibility in chip layout. Industry insiders predict that as Intel continues to promote EMIB to SK Hynix and major OSAT manufacturers, Intel's solution is expected to become a new option in the 2.5D packaging supply chain for AI accelerators in the future.